PDF Determining the Bond Efficiency of industrial grinding circuits
ing design inefficiency factors into the reference Bond Standard Circuit, assume m diameter overflow mills, and use a rod mill F80 of 16,000 µm and a rod mill P80 of 1,000 µm. Note that—in order for no correction factor for ball mill product fineness to apply—the ball mill circuit P80 should be no less than approximately 70 µm ...